YZPST-DPC-16x31 Copper-coated Ceramic Substrate
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General Description
The copper-coated ceramic substrate ueses copper plating technology, and the copper surface is protected by the copper preservative. The metal layer (copper) adheres well to the alumina ceramic substrate. The product has good heat dissipation performance .
Application：Semiconductor device package insulating material
Features:
Min | Max | Uni | |
Metal thickness | 8 | 15 | μm |
Metal adhesion | Raduis of welding sopt:1.5mm Pulling force≧30Kg | Kg | |
Insulated withstand voltage | ≧2500 | V | |
Size：：mm（±0.1）
For more information about YZPST-DPC-16x31 Copper-coated Ceramic Substrate please download the PDF file above named " YZPST-DPC 16X31 "
Power semiconductor devices, protection components and industrial power solutions.
